• DocumentCode
    803337
  • Title

    Modeling of Nonstationary Heating of Semiconductor Structures Under HEMP Actions With Short Pulse Duration

  • Author

    Alexeev, Viktor F. ; Zhuravliov, Vadim I.

  • Author_Institution
    Dept. of Radioelectronic Devices, Byelorussian State Univ., Minsk
  • Volume
    6
  • Issue
    3
  • fYear
    2006
  • Firstpage
    429
  • Lastpage
    435
  • Abstract
    This paper intends to explain the thermal model of the temperature distribution in semiconductor structures that are being subjected to high-power electromagnetic pulses. Taking into account the dependence of the semiconductor thermal conductivity on the temperature, a partial solution of the thermal flow equation with the second-type boundary conditions was used. Also, the role of the thermal conductivity components is evidently demonstrated as they affect the heat transfer. The calculations clearly indicate that the behavior of the thermal transient depends on the pulse duration. This difference in behavior allows forecasting of the thermal damages in the semiconductor devices
  • Keywords
    heat transfer; semiconductor device models; semiconductor heterojunctions; temperature distribution; thermal conductivity; HEMP actions; boundary conditions; heat transfer; high-power electromagnetic pulses; nonstationary heating; semiconductor devices; semiconductor structures; semiconductor thermal conductivity; short pulse duration; temperature distribution; thermal damage; thermal flow equation; thermal model; thermal transient; Boundary conditions; EMP radiation effects; Electromagnetic modeling; Equations; Heat transfer; Heating; Semiconductor devices; Temperature dependence; Temperature distribution; Thermal conductivity; Heating; high-power electromagnetic pulse (HEMP); semiconductor structure; temperature; thermal conductivity;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2006.882200
  • Filename
    1717492