• DocumentCode
    803908
  • Title

    A 1.9-GHz GaAs chip set for the personal handyphone system

  • Author

    McGrath, F. ; Jackson, Karen ; Heaney, Eugene ; Douglas, Allan ; Fahey, Willams ; Pratt, Russell G. ; Begnoche, Ted

  • Author_Institution
    Microelectron. Div., M/A-COM Inc., Lowell, MA, USA
  • Volume
    43
  • Issue
    7
  • fYear
    1995
  • fDate
    7/1/1995 12:00:00 AM
  • Firstpage
    1733
  • Lastpage
    1744
  • Abstract
    The Japanese Personal Handyphone System (PHS) is representative of the latest generation of digital portable communications systems currently being deployed. Enabling technologies for these systems include high performance Radio Frequency Integrated Circuit (RFIC) chip sets. These chip sets allow all the RF transceiver functions to be included in low cost surface mount plastic packages. With the addition of filters and bypassing capacitors, the RF portion of the phone shares the same printed circuit board (PCB) as the DSP, CODEC, and logic ICs. The availability of such highly integrated 1.9-GHz RFICs requires the solution of many complex design, manufacturing, and test problems. This paper explains the critical issues relating to the air interface of the PHS system and how it affects the RFIC design. The chip partition, design, and performance of each subfunction is discussed relative to the requirements imposed by the air interface. The result is a highly integrated, cost effective solution that occupies the minimum board area
  • Keywords
    III-V semiconductors; UHF integrated circuits; cordless telephone systems; digital radio; gallium arsenide; mobile radio; personal communication networks; transceivers; 1.9 GHz; GaAs; PHS system; RF transceiver functions; air interface; chip partition; digital portable communications systems; minimum board area; personal handyphone system; radio frequency integrated circuit chip sets; surface mount plastic packages; Capacitors; Cost function; Filters; Gallium arsenide; Integrated circuit technology; Plastic integrated circuit packaging; Plastic packaging; Radio frequency; Radiofrequency integrated circuits; Transceivers;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/22.392947
  • Filename
    392947