• DocumentCode
    807095
  • Title

    A multiparameter implantable microstimulator SOC

  • Author

    Wang, Chua-Chin ; Lee, Tzung-Je ; Hsiao, Yu-Tzu ; Chio, U. Fat ; Huang, Chi-Chun ; Chin, Jia-Jin J. ; Hsueh, Ya-Hsin

  • Author_Institution
    Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
  • Volume
    13
  • Issue
    12
  • fYear
    2005
  • Firstpage
    1399
  • Lastpage
    1402
  • Abstract
    Various implantable microstimulators have been proposed for clinical applications in recent years. Most of the no-battery implanted devices can be powered by a transcutaneous magnetic coupling, which basically utilizes an external transmitter coil to power and communicate with the implanted device. Small chip area and low power consumption are the keys of the implanted device. Therefore, we propose a C-less (no capacitor) area-saving ASK demodulator in this work to get rid of those large discrete capacitors required for low-frequency ASK demodulation. Additionally, a power regulator supplying a stable VDD/spl I.bar/OUT is also built in to resolve the unstable supply voltage problem resulted from the inductive link. Besides, a multiparameter control protocol which has an area advantage over microcontroller-based solutions is also proposed for various pain treatments of muscles and stimulating applications.
  • Keywords
    biomedical electronics; demodulators; inductive power transmission; integrated circuit design; system-on-chip; C-less area-saving ASK demodulator; SoC; discrete capacitor; microcontroller-based solution; multiparameter control protocol; multiparameter implantable microstimulator; neural interface; nonreturn-to-zero; power regulator; system-on-chip; telemetry; unstable supply voltage problem; Amplitude shift keying; Capacitors; Coils; Couplings; Demodulation; Energy consumption; Magnetic devices; Power supplies; Regulators; Transmitters; Implantable; microstimulator; neural interface; non-return-to-zero (NRZ); system-on-chip; telemetry;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/TVLSI.2005.862719
  • Filename
    1583666