• DocumentCode
    813020
  • Title

    Modification of Molybdenum Gate Electrode Work Function via (La-, Al-Induced) Dipole Effect at High- k/\\hbox {SiO}_{2} Interface

  • Author

    Lim, Andy Eu-Jin ; Lee, Rinus Tek Po ; Samudra, Ganesh S. ; Kwong, Dim-Lee ; Yeo, Yee-Chia

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore
  • Volume
    29
  • Issue
    8
  • fYear
    2008
  • Firstpage
    848
  • Lastpage
    851
  • Abstract
    This letter demonstrates a way for modifying the effective work function Phim of a molybdenum (Mo) gate electrode by interface dipole engineering in a metal gate/high-k gate stack. N-type Mo gate Phim (~4.2 eV) was achieved on a HfLaO gate dielectric even after 950-degC rapid thermal annealing (RTA) due to the presence of a La-induced interface dipole layer. By alloying with ~14%-19% of aluminum (Al), the effective Mo gate Phim on HfLaO significantly increased by ~0.6 eV after 950-degC RTA. The incorporation of Al into the HfLaO gate dielectric was evident after the high-temperature anneal. The Phim modulation was attributed to Al-induced interface dipole formation, of which has opposite polarity to the La-induced dipole, at the high-k/SiO2 interface. This novel concept of employing two opposing interface dipoles in the same metal gate/high-k stack for Phim tunability would provide insights for future gate stack interface engineering.
  • Keywords
    MOS integrated circuits; hafnium compounds; molybdenum; silicon compounds; work function; Mo-HfLaO; SiO2; dipole effects; gate stack interface engineering; interface dipole engineering; molybdenum gate electrode work function; rapid thermal annealing; temperature 950 degC; Alloying; Aluminum; CMOS technology; Dielectric substrates; Electrodes; Hafnium compounds; High K dielectric materials; High-K gate dielectrics; Rapid thermal annealing; Student members; Al; La; Mo; interface dipole; metal gate; work function modification;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2008.2000997
  • Filename
    4571129