DocumentCode
813250
Title
Interconnection parameter extraction of printed circuit board by hybrid measurements of TDR and S-parameter
Author
Kim, Yong-Ju ; Wee, Jae-Kyung ; Kim, Young-Hee ; Lee, Seongsoo
Author_Institution
Memory Res. & Dev. Div., Hynix Semicond. Inc., Kyunggi, South Korea
Volume
38
Issue
17
fYear
2002
fDate
8/15/2002 12:00:00 AM
Firstpage
969
Lastpage
970
Abstract
A modified technique for extracting the electrical parameters of transmission lines on PCBs is proposed. It exploits hybrid measurements of the time domain and frequency domain responses and does not require complicated and erroneous procedures such as DC capacitance measurement and parameter de-embedding. Experimental results show that the proposed method is more accurate than conventional methods
Keywords
S-parameters; electric variables measurement; interconnections; printed circuit testing; time-domain reflectometry; transmission line theory; PCBs; S-parameters; electrical parameters; frequency domain response; hybrid measurements; interconnection parameter extraction; printed circuit board; time domain reflectometry; time domain response; transmission lines;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:20020683
Filename
1031789
Link To Document