DocumentCode
816816
Title
Development of 4H-SiC LJFET-Based Power IC
Author
Zhang, Yongxi ; Sheng, Kuang ; Su, Ming ; Zhao, Jian H. ; Alexandrov, Petre ; Li, Xueqing ; Fursin, Leonid ; Weiner, Maurice
Author_Institution
Dept. of Electr. & Comput. Eng., Rutgers Univ., Piscataway, NJ
Volume
55
Issue
8
fYear
2008
Firstpage
1934
Lastpage
1945
Abstract
A novel lateral junction field-effect transistor (JFET)-based power IC technology in 4H-SiC is presented in detail covering device and circuit design, fabrication, and characterization. The optimal reduced surface field design for the lateral power JFET has been carried out and implemented in the IC fabrication. Since this technology has great promise at high temperatures, the temperature dependences (from room temperature to 300degC) of the threshold voltage, transconductance, resistance, and electron mobility have been fully characterized. Advantages of the SiC vertical-channel lateral JFET (VC-LJFET) technology, such as lower output capacitance (Coss) for lateral power JFETs and adjustable threshold voltages at mask design level, are also discussed. Finally, a monolithic power IC chip integrating a power lateral JFET with its low-voltage buffers is presented, which demonstrated megahertz switching at a power level of 270 W. The successful development of the VC-LJFET technology should hasten the introduction of SiC smart power ICs and eventually the system-on-a-chip applications in harsh environments.
Keywords
electron mobility; field effect integrated circuits; integrated circuit design; power integrated circuits; silicon compounds; wide band gap semiconductors; IC fabrication; LJFET-based power IC; SiC; circuit design; device design; electron mobility; harsh environments; high-temperature electronics; lateral junction field-effect transistor; low-voltage buffers; mask design level; monolithic power IC chip; optimal reduced surface field design; power 270 W; power integrated circuits; smart power IC; system-on-a-chip applications; threshold voltages; transconductance; Circuit synthesis; Electron mobility; FETs; Fabrication; Power integrated circuits; Silicon carbide; Surface resistance; Temperature dependence; Threshold voltage; Transconductance; High-temperature electronics; junction field-effect transistor (JFET); normally off; power integrated circuits; reduced surface electric field (RESURF) effect; silicon carbide (SiC);
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2008.926676
Filename
4578905
Link To Document