DocumentCode
817976
Title
Polymer Optical Interconnects—A Scalable Large-Area Panel Processing Approach
Author
Uhlig, S. ; Frohlich, L. ; Chen, Mei ; Arndt-Staufenbiel, N. ; Lang, G. ; Schroder, H. ; Houbertz, R. ; Popall, M. ; Robertsson, M.
Volume
29
Issue
1
fYear
2006
Firstpage
158
Lastpage
170
Abstract
A flexible approach to producing optical interconnects on 609.6
609.6 mm large-area panels is demonstrated. Stepwise projection patterning from 101.6
101.6 mm masks has generated optical waveguide patterns over the whole panel using large-area projection lithography equipment. The waveguide routing design allows optical waveguides on different 101.6
101.6 mm tiles to be interconnected. Four different waveguide connecting geometries in the border region between tiles have been fabricated and tested. Multimode waveguides from inorganic-organic hybrid polymers (ORMOCER) (cross section:
) with refractive index step between core and cladding
were produced. The index step was adjusted by mixing two diffrent ORMOCER systems. The materials show good adhesion to numerous substrates, such as glass and silicon. Application concepts such as flexible manufacturing of optoelectrical hybrid backplanes with two-dimensional interconnect, a three-dimensional optical interconnect with optical vias, and a hybrid backplane with the optical interconnect in a strip-format on a separate plane right above the electrical plane are proposed. Promising new technologies are presented along with preliminary demonstrativ viability.
609.6 mm large-area panels is demonstrated. Stepwise projection patterning from 101.6
101.6 mm masks has generated optical waveguide patterns over the whole panel using large-area projection lithography equipment. The waveguide routing design allows optical waveguides on different 101.6
101.6 mm tiles to be interconnected. Four different waveguide connecting geometries in the border region between tiles have been fabricated and tested. Multimode waveguides from inorganic-organic hybrid polymers (ORMOCER) (cross section:
) with refractive index step between core and cladding
were produced. The index step was adjusted by mixing two diffrent ORMOCER systems. The materials show good adhesion to numerous substrates, such as glass and silicon. Application concepts such as flexible manufacturing of optoelectrical hybrid backplanes with two-dimensional interconnect, a three-dimensional optical interconnect with optical vias, and a hybrid backplane with the optical interconnect in a strip-format on a separate plane right above the electrical plane are proposed. Promising new technologies are presented along with preliminary demonstrativ viability.Keywords
Flexible manufacturing approach; ORMOCER; hybrid polymers; large-area processing; optical backplane; optical interconnect review; polymer optical waveguide; projection UV lithogaphy; Backplanes; Lithography; Optical interconnections; Optical mixing; Optical polymers; Optical refraction; Optical variables control; Optical waveguides; Routing; Flexible manufacturing approach; ORMOCER; hybrid polymers; large-area processing; optical backplane; optical interconnect review; polymer optical waveguide; projection UV lithogaphy;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2005.849555
Filename
1589143
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