DocumentCode

819386

Title

Bond verification of space shuttle tiles using time-domain techniques

Author

Bennia, Abdelhak ; Su, Wangsheng ; Riad, Sedki M.

Author_Institution

Virginia Institute Polytechnic and State University

Volume

40

Issue

2

fYear

1991

fDate

4/1/1991 12:00:00 AM

Firstpage

493

Lastpage

495

Keywords

Aluminum; Bonding; Capacitive sensors; Dielectric constant; Pulse measurements; Space shuttles; Space vehicles; Temperature; Tiles; Time domain analysis;

fLanguage

English

Journal_Title

Instrumentation and Measurement, IEEE Transactions on

Publisher

ieee

ISSN

0018-9456

Type

jour

DOI

10.1109/TIM.1990.1032994

Filename

1032994