DocumentCode
819754
Title
Environmental-based characterization of SoC-based instrumentation systems for stratified testing
Author
Park, N.-J. ; George, K.M. ; Park, Nohpill ; Choi, Minsu ; Kim, Yong-Bin ; Lombardi, Fabrizio
Author_Institution
Dept. of Comput. Sci., Oklahoma State Univ., Stillwater, OK, USA
Volume
54
Issue
3
fYear
2005
fDate
6/1/2005 12:00:00 AM
Firstpage
1241
Lastpage
1248
Abstract
This paper proposes a novel environmental-based method for evaluating the good yield rate (GYR) of systems-on-chip (SoC) during fabrication. Testing and yield evaluation at high confidence are two of the most critical issues for the success of SoC as a viable technology. The proposed method relies on different features of fabrication, which are quantified by the so-called Fabrication environmental parameters (EPs). EPs can be highly correlated to the yield, so they are analyzed using statistical methods to improve its accuracy and ultimately direct the test process to an efficient execution. The novel contributions of the proposed method are: 1) to establish an adequate theoretical foundation for understanding the fabrication process of SoCs together with an assurance of the yield at a high confidence level and 2) to ultimately provide a realistic approach to SoC testing with an accurate yield evaluation. Simulations are provided to demonstrate that the proposed method significantly improves the confidence interval of the estimated yield as compared with existing testing methodologies such as random testing (RT).
Keywords
integrated circuit testing; integrated circuit yield; statistical analysis; system-on-chip; test equipment; SOC-based instrumentation systems; SoC testing; environmental-based characterization; fabrication environmental parameters; fault coverage; good yield rate; random testing; statistical methods; stratified testing; test process; yield evaluation; Analysis of variance; Circuit faults; Fabrication; Instruments; Intellectual property; Manufacturing; Statistical analysis; System testing; System-on-a-chip; Yield estimation; System on a chip; defect level; fabrication environmental parameter (EP); fault coverage; good yield rate (GYR); random testing (RT); stratified testing (ST);
fLanguage
English
Journal_Title
Instrumentation and Measurement, IEEE Transactions on
Publisher
ieee
ISSN
0018-9456
Type
jour
DOI
10.1109/TIM.2005.847131
Filename
1433201
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