• DocumentCode
    819754
  • Title

    Environmental-based characterization of SoC-based instrumentation systems for stratified testing

  • Author

    Park, N.-J. ; George, K.M. ; Park, Nohpill ; Choi, Minsu ; Kim, Yong-Bin ; Lombardi, Fabrizio

  • Author_Institution
    Dept. of Comput. Sci., Oklahoma State Univ., Stillwater, OK, USA
  • Volume
    54
  • Issue
    3
  • fYear
    2005
  • fDate
    6/1/2005 12:00:00 AM
  • Firstpage
    1241
  • Lastpage
    1248
  • Abstract
    This paper proposes a novel environmental-based method for evaluating the good yield rate (GYR) of systems-on-chip (SoC) during fabrication. Testing and yield evaluation at high confidence are two of the most critical issues for the success of SoC as a viable technology. The proposed method relies on different features of fabrication, which are quantified by the so-called Fabrication environmental parameters (EPs). EPs can be highly correlated to the yield, so they are analyzed using statistical methods to improve its accuracy and ultimately direct the test process to an efficient execution. The novel contributions of the proposed method are: 1) to establish an adequate theoretical foundation for understanding the fabrication process of SoCs together with an assurance of the yield at a high confidence level and 2) to ultimately provide a realistic approach to SoC testing with an accurate yield evaluation. Simulations are provided to demonstrate that the proposed method significantly improves the confidence interval of the estimated yield as compared with existing testing methodologies such as random testing (RT).
  • Keywords
    integrated circuit testing; integrated circuit yield; statistical analysis; system-on-chip; test equipment; SOC-based instrumentation systems; SoC testing; environmental-based characterization; fabrication environmental parameters; fault coverage; good yield rate; random testing; statistical methods; stratified testing; test process; yield evaluation; Analysis of variance; Circuit faults; Fabrication; Instruments; Intellectual property; Manufacturing; Statistical analysis; System testing; System-on-a-chip; Yield estimation; System on a chip; defect level; fabrication environmental parameter (EP); fault coverage; good yield rate (GYR); random testing (RT); stratified testing (ST);
  • fLanguage
    English
  • Journal_Title
    Instrumentation and Measurement, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9456
  • Type

    jour

  • DOI
    10.1109/TIM.2005.847131
  • Filename
    1433201