• DocumentCode
    821198
  • Title

    Package macromodeling via time-domain vector fitting

  • Author

    Grivet-Talocia, S.

  • Author_Institution
    Dipt. di Elettronica, Politecnico di Torino, Italy
  • Volume
    13
  • Issue
    11
  • fYear
    2003
  • Firstpage
    472
  • Lastpage
    474
  • Abstract
    This paper addresses the construction of lumped macromodels for package structures. A technique named Time-Domain Vector Fitting (TD-VF) is introduced for the identification of the dominant poles of the structure. This method uses as raw data transient excitations and responses at the ports of the structure. These responses are easily obtained from transient full-wave electromagnetic solvers based, e.g., on Finite Differences. The rational approximation can be easily synthesized into a SPICE-compatible subcircuit providing a broadband approximation to the input-output behavior of the package.
  • Keywords
    SPICE; finite difference methods; packaging; poles and zeros; time-domain analysis; transient analysis; SPICE subcircuit; finite difference method; lumped macromodel; package structure; pole identification; rational approximation; time-domain vector fitting; transient full-wave electromagnetic simulation; Circuit simulation; Electromagnetic compatibility; Electromagnetic modeling; Electromagnetic transients; Electronics packaging; Equivalent circuits; Finite difference methods; Frequency; Integrated circuit interconnections; Time domain analysis;
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2003.819378
  • Filename
    1243535