DocumentCode
822173
Title
Electromigration and adhesion
Author
Lloyd, James R. ; Lane, Michael W. ; Liniger, Eric G. ; Hu, C.-K. ; Shaw, Thomas M. ; Rosenberg, Robert
Author_Institution
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
Volume
5
Issue
1
fYear
2005
fDate
3/1/2005 12:00:00 AM
Firstpage
113
Lastpage
118
Abstract
It has been demonstrated that, in those instances where electromigration-induced mass transport is dominated by interfacial diffusion, the adhesion at the interface where mass transport is primarily taking place is related to the electromigration flux. Furthermore, it is shown that the cohesive energy of the interface is directly related to the activation energy for diffusion.
Keywords
adhesion; electromigration; interface phenomena; mass transfer; activation energy; adhesion; cohesive energy; electromigration flux; electromigration-induced mass transport; interfacial diffusion; Adhesives; Aluminum alloys; Conducting materials; Conductive films; Conductors; Copper alloys; Dielectrics; Electromigration; Metallization; Temperature;
fLanguage
English
Journal_Title
Device and Materials Reliability, IEEE Transactions on
Publisher
ieee
ISSN
1530-4388
Type
jour
DOI
10.1109/TDMR.2005.846308
Filename
1435394
Link To Document