• DocumentCode
    829430
  • Title

    Some thoughts on the IC design-manufacture interface

  • Author

    Wong, Alfred K.

  • Volume
    22
  • Issue
    3
  • fYear
    2005
  • Firstpage
    206
  • Lastpage
    213
  • Abstract
    In the beginning, there were no design rules. Experts handling IC design and process development were knowledgeable in both disciplines. As circuit variety and complexity increased, a division of labor became necessary during the early 1970s. Since then, design rules have regulated the design-manufacture interface. These rules represent a compromise between designers, who often desire small, densely packed transistors and circuit elements, and manufacturers, who are concerned with high-yielding processes. Circuit models such as Spice parameters for electrical simulation, and geometrical description formats such as Gerber Data Stream II (GDSII) and Caltech Intermediate Form (CIF), complement design rules and serve as a common language between designers and manufacturers. When a layout - the geometrical shapes that collectively describe a circuit - adheres to all design rules, the fabricated circuit functions according to the design. This article provides a clear view of two complementary approaches to managing the increasingly complex design-manufacturing interface, restricted design rules and model-based design. The author´s straightforward discussion is very timely as our industry is moving forward combining both approaches.
  • Keywords
    CAD; computational geometry; integrated circuit design; integrated circuit manufacture; lithography; Caltech Intermediate Form; Gerber Data Stream II; IC design rules; IC design-manufacture interface; electrical simulation; geometrical description formats; Costs; Fabrication; Integrated circuit modeling; Lithography; Manufacturing industries; Manufacturing processes; Process design; Shape; Silicon; Venture capital; IC design-manufacturing interface;
  • fLanguage
    English
  • Journal_Title
    Design & Test of Computers, IEEE
  • Publisher
    ieee
  • ISSN
    0740-7475
  • Type

    jour

  • DOI
    10.1109/MDT.2005.70
  • Filename
    1438274