DocumentCode
832995
Title
Wear-out and breakdown of ultra-thin gate oxides after irradiation
Author
Cester, A.
Author_Institution
Dipt. di Ingegneria dell´´Informazione, Padova Univ., Italy
Volume
38
Issue
19
fYear
2002
fDate
9/12/2002 12:00:00 AM
Firstpage
1137
Lastpage
1139
Abstract
The enhancement of gate leakage current after exposure to ionising radiation is generally believed to be the major challenge for devices and circuits operating in harsh radiation environments. How ultra-thin gate oxides subjected to heavy ion irradiation react to a subsequent electrical stress performed at low voltages has been investigated. Even in devices exhibiting small (or even negligible) enhancement of the leakage current, the time-to-breakdown is substantially reduced in comparison with unirradiated samples due to the onset of a soft or hard breakdown, in contrast with previous results found on thicker oxides
Keywords
CMOS integrated circuits; MOS capacitors; MOSFET; dielectric thin films; ion beam effects; leakage currents; semiconductor device breakdown; CMOS components; LV electrical stress; MOS capacitors; gate leakage current enhancement; gate oxide breakdown; gate oxide wear-out; harsh radiation environments; heavy ion irradiation; ionising radiation; oxide time-to-breakdown; ultra-thin gate oxides;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:20020757
Filename
1038638
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