• DocumentCode
    832995
  • Title

    Wear-out and breakdown of ultra-thin gate oxides after irradiation

  • Author

    Cester, A.

  • Author_Institution
    Dipt. di Ingegneria dell´´Informazione, Padova Univ., Italy
  • Volume
    38
  • Issue
    19
  • fYear
    2002
  • fDate
    9/12/2002 12:00:00 AM
  • Firstpage
    1137
  • Lastpage
    1139
  • Abstract
    The enhancement of gate leakage current after exposure to ionising radiation is generally believed to be the major challenge for devices and circuits operating in harsh radiation environments. How ultra-thin gate oxides subjected to heavy ion irradiation react to a subsequent electrical stress performed at low voltages has been investigated. Even in devices exhibiting small (or even negligible) enhancement of the leakage current, the time-to-breakdown is substantially reduced in comparison with unirradiated samples due to the onset of a soft or hard breakdown, in contrast with previous results found on thicker oxides
  • Keywords
    CMOS integrated circuits; MOS capacitors; MOSFET; dielectric thin films; ion beam effects; leakage currents; semiconductor device breakdown; CMOS components; LV electrical stress; MOS capacitors; gate leakage current enhancement; gate oxide breakdown; gate oxide wear-out; harsh radiation environments; heavy ion irradiation; ionising radiation; oxide time-to-breakdown; ultra-thin gate oxides;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:20020757
  • Filename
    1038638