DocumentCode
835703
Title
Motion stages for electronic packaging design and control
Author
Ding, Han ; Xiong, Zhenhua
Author_Institution
Sch. of Mech. Eng., Shanghai Jiao Tong Univ.
Volume
13
Issue
4
fYear
2006
Firstpage
51
Lastpage
61
Abstract
This paper reviews the design and control progress of motion stages for electronics packaging, specifically, for wire bonding, due to its characteristics of high acceleration and high accuracy. The paper also introduces both conventional serial-type and new parallel-type motion stages. Several modeling techniques and many high performance control schemes are also reviewed
Keywords
electronics packaging; lead bonding; motion control; process control; conventional serial-type motion stages; electronic packaging control; electronic packaging design; parallel-type motion stages; wire bonding; Assembly; Bonding; Electronics industry; Electronics packaging; Integrated circuit packaging; Motion control; Packaging machines; Robotics and automation; Servomotors; Wire;
fLanguage
English
Journal_Title
Robotics & Automation Magazine, IEEE
Publisher
ieee
ISSN
1070-9932
Type
jour
DOI
10.1109/MRA.2006.250562
Filename
4015994
Link To Document