Multilevel behavioral simulation of VCSEL-based optoelectronic modules

The assembly within a single optoelectronic interconnect module of different components, including vertical-cavity semiconductor lasers and photodiode arrays, optical fibers, and electronics implying electrical, optical, mechanical, and thermal interactions, introduces new constraints in the conception phase and necessitates a new and different approach for modeling and simulation. A promising solution, when conceiving optoelectronic microelectromechanical systems, is obtained by simulation with the multilevel language VHDL-AMS based on system component parameters and standards.