Optimization of Thermomechanical Reliability of Board-level Package-on-Package Stacking Assembly

Author

Lai, Yi-Shao ; Wang, Tong Hong ; Wang, Ching-Chun

Author_Institution

Adv. Semicond. Eng. Inc, Kaohsiung

Volume

29

Issue

4

fYear

2006

Firstpage

864

Lastpage

868

Abstract

In this paper, the Taguchi optimization method is applied to obtain the optimal and robust design towards enhancement of board-level thermomechanical reliability of a package-on-package stacking assembly under an accelerated thermal cycling test condition. An L₁₈(2 ¹times3⁷) orthogonal array is arranged for the optimization of eight selected control factors of the assembly, including thickness of dies, molding compounds, and substrates, sizes of package and molding compound, and solder joint standoffs. The importance of each of these control factors is compared and ranked

Keywords

Taguchi methods; ball grid arrays; integrated circuit reliability; system-in-package; Taguchi optimization; accelerated thermal cycling test; board-level reliability; optimal design; package-on-package stacking assembly; robust design; thermomechanical reliability; Assembly; Life estimation; Optimization methods; Packaging; Robustness; Size control; Stacking; Testing; Thermomechanical processes; Thickness control; Board-level reliability; Taguchi; optimization; package-on-package (PoP); thermal cycling;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2006.885970

Filename

4016227