• DocumentCode
    838036
  • Title

    Enhancement of Electrical Properties of Electrically Conductive Adhesives (ECAs) by Using Novel Aldehydes

  • Author

    Li, Yi ; Moon, Kyoung-Sik ; Whitman, Andrew ; Wong, C.P.

  • Author_Institution
    Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA
  • Volume
    29
  • Issue
    4
  • fYear
    2006
  • Firstpage
    758
  • Lastpage
    763
  • Abstract
    To improve the electrical properties of electrically conductive adhesives (ECAs), different types of aldehydes, salicylaldehyde and transcinnamaldehyde, were introduced into ECA formulations. During the curing process, the aldehydes acted as a reducing agent and reduced metal oxide in ECAs. At the same time, aldehydes could consume ambient oxygen and prevent the oxidation of the metal fillers in the ECA. The oxidation product of aldehydes, carboxylic acids with shorter molecular chains, could partially replace or remove the long chain stearic acid (C 18) surfactant on the lubricated Ag flakes and enhance the electrons tunneling between the Ag flakes in the ECAs. As such, the multiple effects of aldehydes in ECAs improved the conductivity significantly. Dynamic mechanical analysis and thermomechanical analysis studies indicated the improved performance for mechanical and physical properties of ECAs as well
  • Keywords
    conductive adhesives; curing; electric properties; mechanical properties; organic compounds; oxidation; surfactants; aldehydes; carboxylic acids; curing process; dynamic mechanical analysis; electrical properties; electrically conductive adhesives; electronic packaging; electrons tunneling; improved conductivity; mechanical properties; oxidation product; reducing agent; salicylaldehyde; thermomechanical analysis; transcinnamaldehyde; Chip scale packaging; Conductive adhesives; Conductivity; Electronics packaging; Electrons; Independent component analysis; Mechanical factors; Oxidation; Performance analysis; Surface-mount technology; in-situ replacement; Electrically conductive adhesives (ECAs); electrical properties improvement; electronic packaging;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2006.885940
  • Filename
    4016228