DocumentCode
838036
Title
Enhancement of Electrical Properties of Electrically Conductive Adhesives (ECAs) by Using Novel Aldehydes
Author
Li, Yi ; Moon, Kyoung-Sik ; Whitman, Andrew ; Wong, C.P.
Author_Institution
Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA
Volume
29
Issue
4
fYear
2006
Firstpage
758
Lastpage
763
Abstract
To improve the electrical properties of electrically conductive adhesives (ECAs), different types of aldehydes, salicylaldehyde and transcinnamaldehyde, were introduced into ECA formulations. During the curing process, the aldehydes acted as a reducing agent and reduced metal oxide in ECAs. At the same time, aldehydes could consume ambient oxygen and prevent the oxidation of the metal fillers in the ECA. The oxidation product of aldehydes, carboxylic acids with shorter molecular chains, could partially replace or remove the long chain stearic acid (C 18) surfactant on the lubricated Ag flakes and enhance the electrons tunneling between the Ag flakes in the ECAs. As such, the multiple effects of aldehydes in ECAs improved the conductivity significantly. Dynamic mechanical analysis and thermomechanical analysis studies indicated the improved performance for mechanical and physical properties of ECAs as well
Keywords
conductive adhesives; curing; electric properties; mechanical properties; organic compounds; oxidation; surfactants; aldehydes; carboxylic acids; curing process; dynamic mechanical analysis; electrical properties; electrically conductive adhesives; electronic packaging; electrons tunneling; improved conductivity; mechanical properties; oxidation product; reducing agent; salicylaldehyde; thermomechanical analysis; transcinnamaldehyde; Chip scale packaging; Conductive adhesives; Conductivity; Electronics packaging; Electrons; Independent component analysis; Mechanical factors; Oxidation; Performance analysis; Surface-mount technology; in-situ replacement; Electrically conductive adhesives (ECAs); electrical properties improvement; electronic packaging;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2006.885940
Filename
4016228
Link To Document