Termination of BME–MLCC Using Copper–Nickel Bimetallic Powder as Electrode Material

Microstructure of termination of a base metal electrode multilayer ceramic capacitor (BME-MLCC) using copper-nickel bimetallic powder as electrode material was investigated. Thick film paste containing nonagglomerated monodispersed copper-nickel bimetallic powder was applied in preparing the termination electrode of a BME-MLCC. Influence of an inorganic binder on the microstructure of the termination of BME-MLCC was studied. The distribution of metallic copper on the surface of glass bubbles in termination was investigated by energy dispersive X-ray. A scanning electron microscope and a polarized light microscope were applied to discuss the microstructure of thick film. The results show that suitable binder and firing temperature result in the excellent connection between internal and termination electrode, as well as one between termination electrode and green chip. The BME-MLCCs with a dense surface of end termination, high adhesion, and qualified electrical behavior were obtained. The rough interface from interfacial reaction between glass and chip gives high adhesion