DocumentCode
841888
Title
Efficient Low-Temperature Data Retention Lifetime Prediction for Split-Gate Flash Memories Using a Voltage Acceleration Methodology
Author
Hu, Ling-Chang ; Kang, An-Chi ; Wu, Tai-Yi ; Shih, J.R. ; Lin, Yao-Feng ; Wu, Kenneth ; King, Ya-Chin
Author_Institution
Dept. of Electr. Eng., Nat. Tsing-Hua Univ., Hsinchu
Volume
6
Issue
4
fYear
2006
Firstpage
528
Lastpage
533
Abstract
In developing a fast statistical testing methodology to predict the postcycling low-temperature data-retention lifetime of split-gate Flash memories, word-line stress is used to accelerate the charge-gain effect responsible for bit-cell-current reduction among the tail-bits. To find out the voltage dependence on data-retention lifetime, various word-line stress voltages are performed to enhance the charge-gain effect of the erase-state cells. At an accelerated state, word-line stress lifetime tests can be completed within a much shorter test period and still provide accurate lifetime prediction for embedded Flash-memory products
Keywords
flash memories; leakage currents; life testing; statistical testing; bit-cell-current reduction; low-temperature data retention lifetime prediction; reliability; split-gate flash memories; stress-induced leakage current; voltage acceleration methodology; word-line stress; Acceleration; Flash memory; Leakage current; Life estimation; Life testing; Predictive models; Split gate flash memory cells; Stress; Temperature; Voltage; Low-temperature data retention (LTDR); program/erase (P/E) cycling; reliability; split-gate Flash memory; stress-induced leakage current (SILC); voltage-acceleration lifetime model;
fLanguage
English
Journal_Title
Device and Materials Reliability, IEEE Transactions on
Publisher
ieee
ISSN
1530-4388
Type
jour
DOI
10.1109/TDMR.2006.883947
Filename
4019418
Link To Document