• DocumentCode
    84214
  • Title

    SEGR in SiO {}_2 –Si _3 N

  • Author

    Javanainen, Arto ; Ferlet-Cavrois, Veronique ; Bosser, Alexandre ; Jaatinen, Jukka ; Kettunen, Heikki ; Muschitiello, Michele ; Pintacuda, Francesco ; Rossi, Mattia ; Schwank, James R. ; Shaneyfelt, Marty R. ; Virtanen, Ari

  • Author_Institution
    Dept. of Phys., Univ. of Jyvaskyla, Jyväskylä, Finland
  • Volume
    61
  • Issue
    4
  • fYear
    2014
  • fDate
    Aug. 2014
  • Firstpage
    1902
  • Lastpage
    1908
  • Abstract
    This paper presents experimental Single Event Gate Rupture (SEGR) data for Metal-Insulator-Semiconductor (MIS) devices, where the gate dielectrics are made of stacked SiO2-Si3N4 structures. A semi-empirical model for predicting the critical gate voltage in these structures under heavy-ion exposure is first proposed. Then interrelationship between SEGR cross-section and heavy-ion induced energy deposition probability in thin dielectric layers is discussed. Qualitative connection between the energy deposition in the dielectric and the SEGR is proposed.
  • Keywords
    MIS devices; dielectric materials; probability; semiconductor device models; silicon compounds; SiO2-Si3N4; gate dielectrics; heavy-ion exposure; heavy-ion induced energy deposition probability; metal-insulator-semiconductor devices; qualitative connection; semi-empirical model; thin dielectric layers; Dielectrics; Electric breakdown; Ions; Logic gates; Silicon; Threshold voltage; $hbox {Si}_{3}hbox {N}_{4}$; $hbox {SiO}_2$ ; MOS; Modeling; Single Event Gate Rupture (SEGR); semi-empirical;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.2014.2303493
  • Filename
    6800102