• DocumentCode
    843413
  • Title

    Development of a low-temperature electro-mechanical testing device

  • Author

    Mbaruku, A.L. ; Trociewitz, U.P. ; Schwartz, J.

  • Author_Institution
    Center for Adv. Power Syst., FAMU-FSU Coll. of Eng., Tallahassee, FL, USA
  • Volume
    15
  • Issue
    2
  • fYear
    2005
  • fDate
    6/1/2005 12:00:00 AM
  • Firstpage
    3620
  • Lastpage
    3623
  • Abstract
    Understanding the strain-sensitivity of high temperature superconductors is important for the development of applications. Conductors for magnets experience mechanical loads during all stages of manufacturing and thermal cycling, as well as Lorentz force induced loads during operation. Thus, it is important to study the effects of mechanical loads on HTS conductors in the presence of magnetic field. Here we report on the development of a tensile testing device that was designed to characterize the in-field electromechanical behavior of HTS conductors. The device is capable of applying tension or compression, controlled fatigue cycles, and in-situ transport critical current measurements. We report on the development and capabilities of the device, as well as the initial stress-strain results at room temperature.
  • Keywords
    critical currents; high-temperature superconductors; magnetic field effects; strain measurement; tensile testing; Lorentz force; high temperature superconductors; in-situ transport critical current measurements; low-temperature electro-mechanical testing device; mechanical loads; strain measurement; strain-sensitivity; tensile testing device; Conductors; High temperature superconductors; Lorentz covariance; Magnetic field measurement; Magnets; Manufacturing; Testing; Thermal conductivity; Thermal force; Thermal loading; Mechanical factors; strain measurement; superconducting materials; test equipment; test facility;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2005.849374
  • Filename
    1440455