DocumentCode
843511
Title
Polymer dielectrics for multichip module packaging
Author
Garrou, Philip
Author_Institution
Dow Chemical Co., Charlotte, NC, USA
Volume
80
Issue
12
fYear
1992
fDate
12/1/1992 12:00:00 AM
Firstpage
1942
Lastpage
1954
Abstract
The polymer dielectrics used to fabricate multichip modules are discussed. Numerous relevant properties of the dielectrics are compared and contrasted. It is shown that the suitability of a specific material is highly dependent on the process chosen to fabricate the structure and the intended application of the module. The material properties of the polymer dielectric must be taken into account when designing the fabrication process in order to exploit the advantages and control the disadvantages that all imperfect materials are bound to have
Keywords
dielectric thin films; hybrid integrated circuits; multichip modules; polymer films; fabrication process; multichip module packaging; polymer dielectrics; Chemical technology; Dielectric thin films; Integrated circuit interconnections; Integrated circuit packaging; Multichip modules; Polymers; Semiconductor device packaging; Substrates; Very large scale integration; Wiring;
fLanguage
English
Journal_Title
Proceedings of the IEEE
Publisher
ieee
ISSN
0018-9219
Type
jour
DOI
10.1109/5.192074
Filename
192074
Link To Document