DocumentCode
843523
Title
Design of multichip modules
Author
Schaper, Leonard W.
Author_Institution
Alcoa Electron. Packaging., San Diego, CA, USA
Volume
80
Issue
12
fYear
1992
fDate
12/1/1992 12:00:00 AM
Firstpage
1955
Lastpage
1964
Abstract
The process and pitfalls of multichip module (MCM) design, including the constraints, tradeoffs, figures of merit, and considerations which make MCM design a unique interdisciplinary challenge are discussed. The MCM must provide the proper operating environment for the chips it contains. It must also fit the constraints of the system in which it is contained. It must be manufacturable, testable, and repairable. The many aspects of MCM design are described, starting with system benefits, then system and MCM partitioning, chip environment, system constraints, and infrastructure/manufacturing issues
Keywords
hybrid integrated circuits; multichip modules; MCM design; MCM partitioning; chip environment; manufacturing; multichip modules; packaging; Art; Books; Conference proceedings; Delay effects; Design automation; Manufacturing; Multichip modules; Packaging; Process design; Testing;
fLanguage
English
Journal_Title
Proceedings of the IEEE
Publisher
ieee
ISSN
0018-9219
Type
jour
DOI
10.1109/5.192075
Filename
192075
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