• DocumentCode
    84720
  • Title

    Y-Band On-Chip Dual Half-Width Leaky-Wave Antenna in a Nanoscale CMOS Process

  • Author

    Jung-Dong Park ; Niknejad, Ali M.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci. (EECS), Univ. of California (UC) Berkeley, Berkeley, CA, USA
  • Volume
    12
  • fYear
    2013
  • fDate
    2013
  • Firstpage
    1476
  • Lastpage
    1479
  • Abstract
    We present a Y-band on-chip half-width leaky-wave antenna for the integrated subterahertz transceiver in a 65-nm digital CMOS process. By utilizing the traveling-wave antenna characteristic, the proposed half-width microstrip leaky-wave antenna (MLWA) structure is concurrently matched to the Rx and Tx, relieving aperture size restriction due to the chip area constraint, while obviating the need for an explicit TR switch. The proposed transceiver (TRx) dual antenna achieves more than 30 GHz of bandwidth (BW), +4.9 dBi of maximum antenna gain, and 26.3% of radiation efficiency at 245 GHz in simulation and measures +5 dBm of maximum equivalent isotropically radiated power (EIRP) with the extremely thin antenna substrate less than 6 μm.
  • Keywords
    CMOS integrated circuits; leaky wave antennas; microstrip antennas; nanofabrication; transceivers; MLWA structure; Y-band on-chip dual half-width leaky-wave antenna; Y-band on-chip half-width leaky-wave antenna; antenna gain; aperture size restriction; bandwidth 30 GHz; chip area constraint; digital CMOS process; equivalent isotropically radiated power; extremely thin antenna substrate; frequency 245 GHz; half-width microstrip leaky-wave antenna; integrated subterahertz transceiver; nanoscale CMOS process; radiation efficiency; size 65 nm; transceiver dual antenna; traveling-wave antenna characteristic; Antenna measurements; Antenna radiation patterns; Leaky wave antennas; Microstrip; Microstrip antennas; System-on-chip; CMOS; Y-band; leaky-wave antennas; on-chip antennas; transceivers;
  • fLanguage
    English
  • Journal_Title
    Antennas and Wireless Propagation Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1536-1225
  • Type

    jour

  • DOI
    10.1109/LAWP.2013.2289950
  • Filename
    6657694