DocumentCode
853150
Title
Impact of Design on High-Frequency Performance of Advanced MIM Capacitors Using Si
N
Die
Author
Piquet, Jérome ; Bermond, éCdric ; Thomas, Maryline ; Farcy, Alexis ; Lacrevaz, Thierry ; Blampey, Benjamin ; Torres, Joaquin ; Fléchet, Bernard ; Angénieux, Gilbert
Author_Institution
LAHC, Univ. de Savoie, Le Bourget du Lac
Volume
31
Issue
3
fYear
2008
Firstpage
546
Lastpage
551
Abstract
High-frequency characterizations of ultra thin 32 nm PECVD Si3N4 dielectric in an advanced metal-insulator-metal (MIM) capacitors are presented, with focus on the impact of design on the performance of MIM capacitors. Frequency dependent capacitance has been extracted over a wide range of frequency bandwidth. An equivalent model circuit of capacitors including four parameters was developed to explain this behavior. The results have been compared with the values obtained from a 3-D electromagnetic modeling. A specific chart has been introduced to predict the electrical performance of new MIM capacitor designs.
Keywords
MIM devices; copper; dielectric thin films; equivalent circuits; plasma CVD coatings; silicon compounds; tantalum compounds; thin film capacitors; 3-D electromagnetic modeling; Cu-Si3N4-TaN-Cu; MIM capacitors; capacitor designs; dielectric layers; equivalent model circuit; frequency dependent capacitance; high-frequency performance; metal-insulator-metal capacitors; size 32 nm; ultra thin PECVD dielectric; High-frequency measurement; SiN dielectric; merit factor; metal–insulator–metal (MIM) capacitor; quality factor; thru reflect line (TRL); vector network analyzer (VNA);
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2008.2001128
Filename
4618398
Link To Document