• DocumentCode
    853150
  • Title

    Impact of Design on High-Frequency Performance of Advanced MIM Capacitors Using Si _{3} N _{4} Die

  • Author

    Piquet, Jérome ; Bermond, éCdric ; Thomas, Maryline ; Farcy, Alexis ; Lacrevaz, Thierry ; Blampey, Benjamin ; Torres, Joaquin ; Fléchet, Bernard ; Angénieux, Gilbert

  • Author_Institution
    LAHC, Univ. de Savoie, Le Bourget du Lac
  • Volume
    31
  • Issue
    3
  • fYear
    2008
  • Firstpage
    546
  • Lastpage
    551
  • Abstract
    High-frequency characterizations of ultra thin 32 nm PECVD Si3N4 dielectric in an advanced metal-insulator-metal (MIM) capacitors are presented, with focus on the impact of design on the performance of MIM capacitors. Frequency dependent capacitance has been extracted over a wide range of frequency bandwidth. An equivalent model circuit of capacitors including four parameters was developed to explain this behavior. The results have been compared with the values obtained from a 3-D electromagnetic modeling. A specific chart has been introduced to predict the electrical performance of new MIM capacitor designs.
  • Keywords
    MIM devices; copper; dielectric thin films; equivalent circuits; plasma CVD coatings; silicon compounds; tantalum compounds; thin film capacitors; 3-D electromagnetic modeling; Cu-Si3N4-TaN-Cu; MIM capacitors; capacitor designs; dielectric layers; equivalent model circuit; frequency dependent capacitance; high-frequency performance; metal-insulator-metal capacitors; size 32 nm; ultra thin PECVD dielectric; High-frequency measurement; SiN dielectric; merit factor; metal–insulator–metal (MIM) capacitor; quality factor; thru reflect line (TRL); vector network analyzer (VNA);
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2008.2001128
  • Filename
    4618398