• DocumentCode
    854461
  • Title

    Deformation of blanketed and patterned bilayer thin-film microstructures during post-release and cyclic thermal loading

  • Author

    Zhang, Yanhang ; Dunn, Martin L.

  • Author_Institution
    Dept. of Mech. Eng., Univ. of Colorado, Boulder, CO, USA
  • Volume
    12
  • Issue
    6
  • fYear
    2003
  • Firstpage
    788
  • Lastpage
    796
  • Abstract
    We study, both experimentally and theoretically, the deformation of blanketed and patterned bilayer thin film microstructures subjected to temperature cycles from room temperature to elevated temperatures following processing by surface micromachining and release from the substrate. While the theoretical treatment is general, the experimental component focuses on beam-like microstructures consisting of a 0.5 μm thick gold film on a polysilicon film that is either 1.5 μm or 3.5 μm thick. For all microstructures the underlying polysilicon film is the same size, but the gold film is patterned into a line that runs the length of the beam. Its width is varied from 0 to 100% of the width of the polysilicon. We experimentally characterize the deformation by measuring the full-field deflection of the gold/polysilicon bilayer beams as a function of temperature using a white-light interferometric microscope. From the deflection, the curvature is determined, and we report the evolution of curvature with the temperature cycling. Qualitatively the behavior is the same regardless of the linewidth. The quantitative differences can be described by a simple model incorporating an inelastic temperature-driven mechanism in addition to linear thermoelastic behavior. We show experimentally and/or analytically, how the parameters in the model vary with linewidth. The results are discussed in the context of the current understanding of microstructural evolution in thin-film metals, and in relation to anticipated thermoelastic response. We show that via a suitable thermal process, the thin film material microstructure can apparently be stabilized over a prescribed temperature range, rendering the subsequent deformation linear thermoelastic. We discuss the implications of these findings in the context of the design and fabrication of high-yield, dimensionally stable MEMS devices utilizing bilayer material systems. Although our measurements are focused on gold/polysilicon bilayer films, the concepts and associated analysis are applicable to other bilayer film systems, particularly ones with metals, although there will surely be quantitative differences.
  • Keywords
    elastic deformation; elemental semiconductors; finite element analysis; gold; light interferometry; metallic thin films; micromachining; micromechanical devices; multilayers; semiconductor thin films; silicon; thermal stresses; thermoelasticity; Au-Si; MEMS multilayers; Si; beam-like microstructures; blanketed bilayer microstructures; deformation; dimensionally stable MEMS; full-field deflection; inelastic temperature-driven mechanism; linear thermoelastic behavior; patterned bilayer microstructures; polysilicon film; surface micromachining; temperature cycles; thin film microstructures; white-light interferometric microscopy; Gold; Micromachining; Microscopy; Microstructure; Substrates; Surface treatment; Temperature; Thermal loading; Thermoelasticity; Transistors;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2003.820263
  • Filename
    1257356