DocumentCode
855221
Title
The dependence of the microstructure and magnetic properties of CoNiCr/Cr thin films on the substrate temperature
Author
Duan, S.L. ; Artman, J.O. ; Wong, B. ; Laughlin, D.E.
Author_Institution
Carnegie Mellon Univ., Pittsburgh, PA, USA
Volume
26
Issue
5
fYear
1990
fDate
9/1/1990 12:00:00 AM
Firstpage
1587
Lastpage
1589
Abstract
Thin CoNiCr/Cr films (candidates for longitudinal recording media) were deposited on Corning 7059 glass substrate by RF diode sputtering. The CoNiCr layer thickness was fixed at 40 nm; the Cr layer thickness, d Cr, ranged between 60 and 400 nm. At d Cr=170 nm, when the substrate temperature before deposition, T s, was set below 100°C, both the Cr underlayer and the CoNiCr layer were more or less randomly oriented. When specimens were deposited at T s⩾200°C, the Cr layer was strongly {100} textured and the CoNiCr layer exhibited a strongly preferred texture. This CoNiCr texture is epitaxially favored by the Cr {100} texture. With increasing d Cr the Cr {110} texture increased and the CoNiCr texture decreased. The grain size increased with T s and d Cr. In-plane coercivity, H c, initially increased with T s to peak at T s=200°C. As T s was increased further from 200 to 260°C, H c decreased. The squareness and saturation magnetization were not sensitive to T s
Keywords
chromium; chromium alloys; cobalt alloys; coercive force; grain size; magnetic recording; magnetic thin films; magnetisation; nickel alloys; sputtered coatings; texture; 100 to 260 degC; CoNiCr-Cr; CoNiCr/Cr thin films; Corning 7059 glass substrate; Cr underlayer; RF diode sputtering; coercivity; grain size; layer thickness; longitudinal recording media; magnetic properties; microstructure; preferred texture; saturation magnetization; squareness; substrate temperature; Chromium; Diodes; Glass; Magnetic films; Magnetic properties; Magnetic recording; Microstructure; Radio frequency; Sputtering; Substrates;
fLanguage
English
Journal_Title
Magnetics, IEEE Transactions on
Publisher
ieee
ISSN
0018-9464
Type
jour
DOI
10.1109/20.104456
Filename
104456
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