• DocumentCode
    860431
  • Title

    SNS-DC-SQUIDs and flux transformers for integrated magnetometers in flip-chip technique

  • Author

    Meyer, B. ; Hollkott, J. ; Francke, C. ; Wunderlich, R. ; Muller, J.

  • Author_Institution
    Semicond. Dept., Tech. Univ. Hamburg-Harburg, Germany
  • Volume
    5
  • Issue
    2
  • fYear
    1995
  • fDate
    6/1/1995 12:00:00 AM
  • Firstpage
    2350
  • Lastpage
    2353
  • Abstract
    YBa/sub 2/Cu/sub 3/O/sub 7-/spl delta///Ag/YBa/sub 2/Cu/sub 3/O/sub 7-/spl delta// Josephson-junctions across steps in MgO substrates were used to fabricate SNS-DC-SQUIDs in the step-and-gap geometry. The necessary break of the YBa/sub 2/Cu/sub 3/O/sub 7-/spl delta//-film at the step was confirmed by transmission electron microscopy investigations. The removal of the Ag-layer eliminates the shunt resistance on top of the HTSC which increases the normal resistance R/sub N/ by more than two orders of magnitude with only a slight reduction in I/sub C/. The junctions can be described by the SINS-formalism, which allows high I/sub C/R/sub N/-products with large values of the normal resistances R/sub N/. For thin-film flux transformer epitaxial YBa/sub 2/Cu/sub 3/O/sub 7-/spl delta///SrTiO/sub 3//YBa/sub 2/Cu/sub 3/O/sub 7-/spl delta// trilayers were grown using a co-sputter process. Test coils exhibited a current density in excess of 8/spl times/10/sup 5/ A/cm/sup 2/ and insulation resistivities of 10/sup 8/ /spl Omega/cm at 77 K. By coupling the flux transformers to SQUIDs using a flip-chip technology the magnetic field response were increased by a factor of 9.<>
  • Keywords
    Josephson effect; SQUID magnetometers; barium compounds; flip-chip devices; high-temperature superconductors; superconducting device testing; yttrium compounds; 77 K; Ag layer removal; HTS flux transformers; HTSC film; Josephson junctions; MgO; MgO substrates; SINS formalism; SNS-DC-SQUIDs; YBCO; YBa/sub 2/Cu/sub 3/O/sub 7-/spl delta// film; YBa/sub 2/Cu/sub 3/O/sub 7/-Ag-YBa/sub 2/Cu/sub 3/O/sub 7/; YBa/sub 2/Cu/sub 3/O/sub 7/-SrTiO/sub 3/-YBa/sub 2/Cu/sub 3/O/sub 7/; co-sputter process; epitaxial trilayers; flip-chip technique; integrated magnetometers; magnetic field response; step/gap geometry; thin-film flux transformer; transmission electron microscopy investigation; Coils; Conductivity; Current density; Geometry; Insulation testing; Magnetometers; Power transformer insulation; Substrates; Transistors; Transmission electron microscopy;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/77.403057
  • Filename
    403057