Investigation of Microscale Magnetic Forces for Magnet Array Self-Assembly

Author

Shetye, Sheetal B. ; Agashe, Janhavi S. ; Arnold, David P.

Author_Institution

Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL

Volume

43

Issue

6

fYear

2007

fDate

6/1/2007 12:00:00 AM

Firstpage

2713

Lastpage

2715

Abstract

This paper focuses on quantification and optimization of micromagnetic bonding forces to enable a technique of magnet array self-assembly (MASA). MASA is envisioned to uniquely assemble different microscale components using arrays of hard micromagnets, which are pre-patterned onto the component surfaces via batch-fabrication. Finite-element (FEM) and analytical methods are used to analyze the dependence of magnetic bonding forces on the size, shape, and magnetization of individual pairs of magnets as well as arrays of magnets. The advantages of using micromagnet arrays in place of single magnets for chip scale self-assembly are explored

Keywords

finite element analysis; magnetisation; micromagnetics; FEM; batch fabrication; finite element method; hard micromagnet arrays; magnet array self-assembly; magnetic bonding forces; micromagnetic bonding forces; microscale magnetic forces; Bonding forces; Finite element methods; Magnetic analysis; Magnetic forces; Magnetization; Manipulators; Manufacturing; Robotic assembly; Self-assembly; Shape; Magnetic forces; self-assembly;

fLanguage

English

Journal_Title

Magnetics, IEEE Transactions on

Publisher

ieee

ISSN

0018-9464

Type

jour

DOI

10.1109/TMAG.2007.893707

Filename

4202907