DocumentCode
861121
Title
Fabrication of 2700-V 12-
Non Ion-Implanted 4H-SiC BJTs
Author
Ghandi, Reza ; Lee, Hyung-Seok ; Domeij, Martin ; Buono, Benedetto ; Zetterling, Carl-Mikael ; Östling, Mikael
Author_Institution
Sch. of Inf. & Commun. Technol., R. Inst. of Technol., Stockholm
Volume
29
Issue
10
fYear
2008
Firstpage
1135
Lastpage
1137
Abstract
High-voltage blocking (2.7-kV) implantation-free SiC bipolar junction transistors with low ON-state resistance (12 mOmegaldrcm2) and high common-emitter current gain of 50 have been fabricated. A graded-base doping was implemented to provide a low-resistive ohmic contact to the epitaxial base. This design features a fully depleted base layer close to the breakdown voltage providing an efficient epitaxial JTE without ion implantation. Eliminating all ion implantation steps in this approach is beneficial for avoiding high-temperature dopant activation annealing and for avoiding generation of lifetime-killing defects that reduce the current gain.
Keywords
ohmic contacts; power bipolar transistors; power semiconductor devices; semiconductor doping; silicon compounds; wide band gap semiconductors; SiC; bipolar junction transistor; breakdown voltage; common-emitter current gain; epitaxial JTE; graded-base doping; high-voltage blocking; low ON-state resistance; low-resistive ohmic contact; non ion-implanted BJT fabrication; voltage 2.7 kV; Bipolar junction transistors (BJTs); power transistors; silicon carbide;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2008.2004419
Filename
4624559
Link To Document