• DocumentCode
    863670
  • Title

    Microstructure and magnetic properties of thin-film Co-Ni-Pt for longitudinal recording

  • Author

    Mahvan, N. ; Zeltser, A.M. ; Lambeth, D.N. ; Laughlin, D.E. ; Kryder, M.H.

  • Author_Institution
    Carnegie-Mellon Univ., Pittsburgh, PA, USA
  • Volume
    26
  • Issue
    5
  • fYear
    1990
  • fDate
    9/1/1990 12:00:00 AM
  • Firstpage
    2277
  • Lastpage
    2279
  • Abstract
    The dependence of microstructure and magnetic properties of RF-sputtered thin films of Co-Ni-Pt deposited on NiP/Al and Cr/NiP/Al substrates was studied as a function of platinum composition, Ar pressure, and sputtering power. Transmission electron microscopy and electron and X-ray diffraction were utilized to determine the correlation between the observed coercivity, remanence squareness behavior, and microstructure. It has been found that in the case of films on NiP/Al substrates, the coercivity is controlled by the grain size, whereas it is dominated by the relative amount of the HCP and FCC cobalt phases for the films deposited on a 300-nm Cr underlayer. An increase in the Ar pressure leads to a further increase in coercivity for both substrates. This behavior was attributed to an increase in the grain size and a more favorable c-axis orientation of the HCP cobalt phase for Cr and NiP underlayers, respectively
  • Keywords
    cobalt alloys; coercive force; crystal atomic structure of alloys; ferromagnetic properties of substances; magnetic tapes; magnetic thin films; nickel alloys; platinum alloys; sputtered coatings; CoNiPt-Cr-NiP-Al; CoNiPt-NiP-Al; Cr-NiP-Al substrate; NiP-Al substrate; RF-sputtered thin films; TEM analysis; X-ray diffraction; coercivity; grain size; magnetic properties; microstructure; remanence squareness behavior; sputtering power; Argon; Chromium; Coercive force; Electrons; Grain size; Magnetic films; Magnetic properties; Microstructure; Sputtering; Substrates;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.104696
  • Filename
    104696