On-Chip Optical Interconnect Roadmap: Challenges and Critical Directions

Author

Hauryla, Mikhail ; Chen, Guoqing ; Chen, Hui ; Zhang, Jidong ; Nelson, Nicholas A. ; Albonesi, David H. ; Friedman, Eby G. ; Fauchet, Philippe M.

Author_Institution

Dept. of Electr. & Comput. Eng., Rochester Univ., NY

Volume

12

Issue

6

fYear

2006

Firstpage

1699

Lastpage

1705

Abstract

Intrachip optical interconnects (OIs) have the potential to outperform electrical wires and to ultimately solve the communication bottleneck in high-performance integrated circuits. Performance targets and critical directions for ICs progress are yet to be fully explored. In this paper, the International Technology Roadmap for Semiconductors (ITRS) is used as a reference to explore the requirements that silicon-based ICs must satisfy to successfully outperform copper electrical interconnects (IEs). Considering the state-of-the-art devices, these requirements are extended to specific IC components

Keywords

integrated optics; integrated optoelectronics; optical interconnections; silicon; International Technology Roadmap for Semiconductors; high-performance integrated circuits; integrated circuit components; intrachip optical interconnects; on-chip optical interconnect; silicon-based integrated circuits; CMOS process; Copper; Delay; Integrated circuit interconnections; Optical interconnections; Optical waveguides; Power system interconnection; Repeaters; Silicon; Wires; Integrated optoelectronic circuits; optical interconnects (ICs); optoelectronics; silicon photonics;

fLanguage

English

Journal_Title

Selected Topics in Quantum Electronics, IEEE Journal of

Publisher

ieee

ISSN

1077-260X

Type

jour

DOI

10.1109/JSTQE.2006.880615

Filename

4032654