DocumentCode
864794
Title
Integration of microstrip antenna on cavity-down ceramic ball grid array package
Author
Zhang, Y.P.
Author_Institution
Nanyang Technol. Univ. Sch. of Electr. & Electron. Eng., Singapore, Singapore
Volume
38
Issue
22
fYear
2002
fDate
10/24/2002 12:00:00 AM
Firstpage
1307
Lastpage
1308
Abstract
The integration of a microstrip antenna on a thin 17×17×2 mm cavity-down ceramic ball grid array package is reported. The antenna, intended for use in either single-chip or single-package wireless transceivers, has achieved an impedance bandwidth of 1.25% and gain of 4.6 dBi at 5.15 GHz.
Keywords
antenna radiation patterns; ball grid arrays; ceramic packaging; microstrip antennas; transceivers; 4.6 dB; 5.15 GHz; antenna gain; cavity-down ceramic ball grid array package; far-field co-polarised radiation patterns; impedance bandwidth; microstrip antenna; single-chip wireless transceivers; single-package wireless transceivers;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:20020937
Filename
1047062
Link To Document