The multipurpose integrated electronic processor

At the University of Ottawa, a Multipurpose Integrated Electronic Processor (MIEP) is being built for basic research in integrated electronics and its related fields. When completed, the MIEP will permit controlled deposition of thin films, electron-beam micromachining, topological inspection and chemical analysis of the films. These processes will be achieved without the need of moving the substrate from one chamber to another, with the associated problems of reregistration and maintaining clean surfaces. The primary aim of the project is the fabrication of thin-film integrated circuits containing micron-sized active and passive elements.