• DocumentCode
    873686
  • Title

    Hierarchical block boundary-element method (HBBEM): a fast field solver for 3-D capacitance extraction

  • Author

    Lu, Taotao ; Wang, Zeyi ; Yu, Wenjian

  • Author_Institution
    Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
  • Volume
    52
  • Issue
    1
  • fYear
    2004
  • Firstpage
    10
  • Lastpage
    19
  • Abstract
    As feature size decrease, fast and accurate parasitic capacitance extraction has become increasingly critical for verification and analysis in very large scale integration design. In this paper, a fast hierarchical-block boundary-element method based on the boundary-element method (BEM) is presented for three-dimensional (3-D) capacitance extraction, which can give out the global capacitance matrix directly. It assigns the global computation of 3-D domain into local computation in BEM blocks by hierarchical partition 3-D structure. The boundary capacitance matrix (BCM) is computed in the BEM block using all the known conditions. Reuse technology can decrease the running time. After merging the BCMs of all BEM blocks, the global capacitance matrix for a given set of conductors can be computed. Numerical results show that this global hierarchical approach can get very high speed in 3-D computation with equal accuracy as the 3-D field solver.
  • Keywords
    Laplace equations; VLSI; boundary-elements methods; capacitance; circuit CAD; circuit complexity; integrated circuit design; integrated circuit interconnections; 3-D capacitance extraction; Laplace equation; boundary capacitance matrix; cross-bus structure; fast field solver; global capacitance matrix; global hierarchical approach; hierarchical block boundary-element method; hierarchical efficiency; hierarchical partition 3-D structure; interconnect capacitance; reuse technology; time complexity; very large scale integration; Acceleration; Conductors; Delay systems; Equations; Merging; Parameter extraction; Parasitic capacitance; Timing; Two dimensional displays; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/TMTT.2003.821228
  • Filename
    1262669