DocumentCode
875861
Title
A two-terminal transistor memory cell using breakdown
Author
Mar, Jerry
Volume
6
Issue
5
fYear
1971
Firstpage
280
Lastpage
283
Abstract
The features of the cell include easy fabrication, small cell area, large output signals, high-speed Read and Write capability, low average power and inherent immunity to small voltage perturbations. The storage time of the cell is determined by reverse-bias junction leakage and is greater than 10 ns at room temperatures for typical devices. Breakdown degradation of transistors is discussed and a memory fabrication scheme that avoids this degradation is suggested. Some early experimental results are mentioned.
Keywords
Charge storage diodes; Random-access storage; Semiconductor junctions; Semiconductor storage devices; charge storage diodes; random-access storage; semiconductor junctions; semiconductor storage devices; Avalanche breakdown; Degradation; Electric breakdown; Fabrication; P-n junctions; Parasitic capacitance; Silicon; Telephony; Temperature; Voltage;
fLanguage
English
Journal_Title
Solid-State Circuits, IEEE Journal of
Publisher
ieee
ISSN
0018-9200
Type
jour
DOI
10.1109/JSSC.1971.1050187
Filename
1050187
Link To Document