Constitutive relations for tin-based solder joints

Author

Darveaux, Robert ; Banerji, Kingshuk

Author_Institution

Motorola Inc., Fort Lauderdale, FL, USA

Volume

15

Issue

6

fYear

1992

fDate

12/1/1992 12:00:00 AM

Firstpage

1013

Lastpage

1024

Abstract

Extensive data on 62Sn36Pb2Ag, 60Sn40Pb, 96.5Sn3.5Ag, 97.5Pb2.5Sn, and 95Pb5Sn solder are presented. All of the data were collected on soldered assemblies to properly account for the effects of grain size and intermetallic compound distribution. Tensile and shear loading were employed in the strain rate range between 10^-8 and 10^-1 s^-1 and the temperature range between 25 and 135°C. It is remarkable to note that all of the data can be fit to the same general form of constitutive relations; i.e., only the constants depend on the solder alloy. The derived constitutive relations are used to predict solder joint response under thermal cycling. Based on the calculated hysteresis loops, it is apparent that each solder will have a different acceleration factor between field use cycling and accelerated test cycling

Keywords

creep; environmental testing; lead alloys; life testing; materials testing; silver alloys; soldering; tin alloys; 25 to 135 C; SnAg; SnPb; SnPbAg; accelerated test cycling; acceleration factor; constitutive relations; creep; damage accumulation; effects of grain size; field use cycling; hysteresis loops; intermetallic compound distribution; shear loading; solder alloy; solder joints; soldered assemblies; strain rate range; temperature range; tensile loadings; thermal cycling; Assembly; Capacitive sensors; Creep; Grain size; Life estimation; Soldering; Steady-state; Stress; Temperature; Testing;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.206925

Filename

206925