• DocumentCode
    880621
  • Title

    Layout of Decoupling Capacitors in IP Blocks for 90-nm CMOS

  • Author

    Meng, Xiongfei ; Saleh, Resve ; Arabi, Karim

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of British Columbia, Vancouver, BC
  • Volume
    16
  • Issue
    11
  • fYear
    2008
  • Firstpage
    1581
  • Lastpage
    1588
  • Abstract
    On-chip decoupling capacitors (decaps) in the form of MOS transistors are widely used to reduce power supply noise. This paper provides guidelines for standard cell layouts of decaps for use within Intellectual Property (IP) blocks in application-specific integrated circuit (ASIC) designs. At 90-nm CMOS technology and below, a tradeoff exists between high-frequency effects and electrostatic discharge (ESD) reliability when designing the layout of such decaps. In this paper, the high-frequency effects are modeled using simple equations. A metric is developed to determine the optimal number of fingers based on the frequency response. Then, a cross-coupled design is described that has been recently introduced by cell library developers to handle ESD problems. Unfortunately, it suffers from poor response times due the large resistance inherent in its design. Improved cross-coupled designs are presented that properly balance issues of frequency response with ESD performance, while greatly reducing thin-oxide gate leakage.
  • Keywords
    CMOS integrated circuits; MOS capacitors; application specific integrated circuits; electrostatic discharge; industrial property; integrated circuit layout; CMOS; IP blocks; MOS capacitors; application-specific integrated circuit designs; decoupling capacitors; electrostatic discharge; high-frequency effects; integrated circuit layout; intellectual property blocks; reliability; size 90 nm; Electrostatic discharges; MOS capacitors; integrated circuit layout; leakage currents;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/TVLSI.2008.2001240
  • Filename
    4637919