0.18-μm CMOS push-pull power amplifier with antenna in IC package

Author

Wei Wang ; Zhang, Y.P.

Author_Institution

Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore

Volume

14

Issue

1

fYear

2004

Firstpage

13

Lastpage

15

Abstract

A novel architecture of power amplifier with antenna implemented in a ceramic ball grid array (CBGA) package is presented. The monolithic power amplifier designed in a standard 0.18- μm CMOS technology offers 19.5 dBm maximum output power at 5.2 GHz to the antenna with the PAE of 32%. The antenna integrated in the CBGA package achieves impedance bandwidth of 3.86% and gain of 2 dBi at 5.2 GHz. Results demonstrate the feasibility of using this innovative configuration to the design of single-chip 5 GHz transmitter front-end.

Keywords

CMOS analogue integrated circuits; MMIC power amplifiers; ball grid arrays; ceramic packaging; differential amplifiers; integrated circuit design; integrated circuit packaging; microstrip antennas; 0.18 micron; 2 dB; 5.2 GHz; CMOS power amplifier; CMOS push-pull power amplifier; IC package; ceramic ball grid array package; impedance bandwidth; integrated antenna; monolithic power amplifier; output power; single-chip transmitter front-end; Bandwidth; CMOS integrated circuits; CMOS technology; Ceramics; Electronics packaging; Impedance; Integrated circuit packaging; Power amplifiers; Power generation; Transmitters;

fLanguage

English

Journal_Title

Microwave and Wireless Components Letters, IEEE

Publisher

ieee

ISSN

1531-1309

Type

jour

DOI

10.1109/LMWC.2003.821489

Filename

1264048