DocumentCode
885336
Title
Improving the reliability and safety of automotive electronics
Author
Zanoni, Enrico ; Pavan, Paolo
Author_Institution
Padua Univ., Italy
Volume
13
Issue
1
fYear
1993
Firstpage
30
Lastpage
48
Abstract
The activities of the European Prometheus project´s PRO-CHIP research groups, which have studied the problem of improving automotive electronic reliability while respecting the specifications of low-cost, high-volume production, light weight, compactness, and short time-to-market imposed by the automotive industry, are reviewed. The reliability problems most frequently encountered by electronic devices for automotive applications, including failure mechanisms due to the package or to the assembling technology, different kinds of electrical overstress, electrostatic discharge, electromagnetic interference, breakdown and burnout of power devices, and failure mechanisms accelerated by high temperatures and high current densities, and the procedures the manufacturers use to evaluate and improve the reliability of their products are discussed.<>
Keywords
automotive electronics; reliability; safety; PRO-CHIP; assembling; automotive electronics; breakdown; burnout; electrical overstress; electromagnetic interference; electrostatic discharge; failure mechanisms; reliability; safety; Automotive applications; Automotive electronics; Automotive engineering; Electrical products industry; Electronics industry; Electronics packaging; Failure analysis; Production; Safety; Time to market;
fLanguage
English
Journal_Title
Micro, IEEE
Publisher
ieee
ISSN
0272-1732
Type
jour
DOI
10.1109/40.210523
Filename
210523
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