Deformation Behavior of MEMS Gyroscope Sensor Package Subjected to Temperature Change

In microelectromechanical system (MEMS) devices, the deformation of MEMS structure caused by packaging induced stress is of great concern since it directly affects the performance of the device. In this paper, deformation behavior of the MEMS gyroscope package subjected to temperature change is investigated using a high-sensitivity moire interferometry. Temperature dependent analyses of warpage and extension/contraction of the package are presented. Analysis of the package reveals that global bending deformation occurs due to the mismatch of the coefficient of thermal expansion between the chip, the molding compound, and the printed circuit board. Detailed global and local deformations of the package by temperature change are investigated, and their effect on the frequency shift of the MEMS gyroscope is studied. It is found that package deformation or package induced stress results in the frequency shift of the MEMS gyroscope structure. In order to increase robustness of the structure against deformation, a "crab-leg" type spring is replaced with a semi-folded spring. The results show that the frequency shift is greatly reduced after applying the semi-folded spring. This frequency shift is within the tolerance limit of the gyroscope sensor in this work