DocumentCode
889043
Title
Basic Technology for VLSI (Part II)
Author
Tarui, Yasuo
Volume
15
Issue
4
fYear
1980
fDate
8/1/1980 12:00:00 AM
Firstpage
386
Lastpage
396
Abstract
This paper describes some of the recent work in the field of basic technology at VLSI Cooperative Laboratories. In microfabrication technology, a pair of high-speed electron-beam pattern delineators, electron-beam mask inspection, a pair of electron-beam projection systems, an X-ray lithography system, and electron-beam and X-ray resists are described. Thermally induced microdefects in silicon crystal are analyzed. A plasma etching system, basic testing and evacuation, and basic devices are also discussed.
Keywords
Electron beam lithography; Electron resists; Integrated circuit technology; Integrated circuit testing; Large scale integration; Masks; Sputter etching; Etching; Inspection; Laboratories; Plasma applications; Plasma devices; Plasma x-ray sources; Resists; Silicon; Very large scale integration; X-ray lithography;
fLanguage
English
Journal_Title
Solid-State Circuits, IEEE Journal of
Publisher
ieee
ISSN
0018-9200
Type
jour
DOI
10.1109/JSSC.1980.1051411
Filename
1051411
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