• DocumentCode
    892743
  • Title

    Benefits of Integrated-Circuit Burn-In to Obtain High Reliability Parts

  • Author

    Pantic, Dragan

  • Author_Institution
    Siliconix Inc., Santa Clara
  • Volume
    35
  • Issue
    1
  • fYear
    1986
  • fDate
    4/1/1986 12:00:00 AM
  • Firstpage
    3
  • Lastpage
    6
  • Abstract
    The technique of integrated circuit (IC) burn-in is applied industry-wide with the assumption that burned-in ICs have a much lower failure rate during operating life than ICs which are not burned-in. Several years ago this approach was valid for all ICs, but today burn-in procedures for some ICs provide little, if any, benefit. However, some customers still request burned-in ICs, assuming that this will produce better reliability. This paper provides historical data for linear ICs and presents a procedure to help the user determine if burn-in is worthwhile. An example for linear ICs where minimum benefit produced from burn-in is provided. By repeating this exercise with any other parts, the user can decide whether burn-in will decrease the failure rate appreciably for his application. This article deals specifically with decreases in failure rates through burn-in. It is not within the scope of this paper to describe general factors that could decrease failure rates.
  • Keywords
    Aging; Circuit testing; History; Integrated circuit reliability; Life estimation; Life testing; Reliability engineering; Shape; Stress; Temperature;
  • fLanguage
    English
  • Journal_Title
    Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9529
  • Type

    jour

  • DOI
    10.1109/TR.1986.4335327
  • Filename
    4335327