DocumentCode
898469
Title
Feature - From chips to systems via packaging - A comparison of IBM´s mainframe servers
Author
Harrer, H. ; Katopis, G.A. ; Becker, W.
Volume
6
Issue
4
fYear
2006
Firstpage
32
Lastpage
41
Abstract
This paper gives a comparison the IBM main frame packaging technology and hardware system structure for the last three CMOS generations (z900, z990 and z9) and presents an outlook on the key challenges for the future. The chip and packaging technologies have enabled a node like structure which resulted in a modular concept supporting the IBM On Demand Business Concept. The key challenges for the high-end servers which are the continuously increasing data bandwidth and the increasing node power are discussed
Keywords
IBM computers; computer architecture; integrated circuit packaging; microprocessor chips; CMOS; IBM mainframe packaging technology; IBM mainframe servers; computer architecture; data bandwidth; hardware system structure; high-end servers; microprocessors; CMOS technology; Capacitance; Cooling; Copper; Integrated circuit interconnections; Leakage current; Packaging; Refrigeration; Temperature; Voltage;
fLanguage
English
Journal_Title
Circuits and Systems Magazine, IEEE
Publisher
ieee
ISSN
1531-636X
Type
jour
DOI
10.1109/MCAS.2006.264840
Filename
4042105
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