• DocumentCode
    904134
  • Title

    Relationship Between Surface Electrostatic Potential and Deposition of Airborne Bacteria

  • Author

    Miksch, Robert R. ; Gefter, Peter ; Gehlke, Scott ; Halpin, Helen Ann ; Meschke, John Scott ; Smith, Brian ; Yost, Michael

  • Author_Institution
    IEH Labs. & Consulting Inc., Forest Park, WA
  • Volume
    45
  • Issue
    3
  • fYear
    2009
  • Firstpage
    1068
  • Lastpage
    1073
  • Abstract
    Recent work has demonstrated that airborne bacteria can carry high net charges which may influence their deposition onto surfaces. This paper investigated the relationship between surface electric potential relative to ground and the deposition rate of airborne bacteria. Nutrient-agar settle plates were charged to potentials of +/-5, +/- 2.5, and 0 kV and microbial deposition (CFU/cm2middoth) enumerated in an office restroom environment. Results showed that deposition rates were enhanced in proportion to the surface potential to a maximum of approximately twofold. The results were consistent with framework modeling of the relative contributions of electrostatic attraction (ESA), sedimentation, and diffusion deposition rates. It is concluded that ESA can significantly increase deposition rates under selected conditions. This has implications for health-care settings and may provide a basis for application of particle-deposition-reduction engineering controls that have been successfully employed in the semiconductor industry.
  • Keywords
    aerosols; electric fields; integrated circuit manufacture; microorganisms; surface potential; airborne bacteria; deposition rate; electrostatic attraction; health-care; particle-deposition-reduction; semiconductor industry; surface electrostatic deposition; surface electrostatic potential; Aerosols; Contamination; Electric potential; Electrokinetics; Electronics industry; Electrostatics; Microorganisms; Occupational health; Plastics; Public healthcare; Airborne bacteria; bioaerosols; bipolar ionization; deposition rate; health care; unipolar deposition;
  • fLanguage
    English
  • Journal_Title
    Industry Applications, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-9994
  • Type

    jour

  • DOI
    10.1109/TIA.2009.2018977
  • Filename
    4957534