• DocumentCode
    917442
  • Title

    Elimination of mesa-sidewall gate leakage in InAlAs/InGaAs heterostructures by selective sidewall recessing

  • Author

    Bahl, Sandeep R. ; del Alamo, Jesús A.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA
  • Volume
    13
  • Issue
    4
  • fYear
    1992
  • fDate
    4/1/1992 12:00:00 AM
  • Firstpage
    195
  • Lastpage
    197
  • Abstract
    Conventional mesa isolation in InAlAs/InGaAs HFETs results in the gate coming in contact with the exposed channel at the mesa sidewall, forming a parasitic gate-leakage path. The authors propose a simple method of recessing the channel edge into the mesa sidewall using a succinic-acid-based selective etchant for InGaAs over InAlAs. SEM photographs confirm the recessing of the channel along the sidewall. Special heterostructure diodes, designed with varying amounts of mesa-sidewall/gate-metal overlap, were fabricated with and without the sidewall isolation step. Electrical measurements confirm the complete elimination of sidewall leakage. for both diodes and HFETs.<>
  • Keywords
    III-V semiconductors; aluminium compounds; etching; field effect transistors; gallium arsenide; indium compounds; leakage currents; semiconductor diodes; semiconductor technology; HFETs; InAlAs-InGaAs; InGaAs; SEM photographs; heterostructure diodes; mesa sidewall gate leakage elimination; parasitic gate-leakage path; selective sidewall recessing; sidewall isolation step; succinic-acid-based selective etchant; Etching; Gate leakage; HEMTs; Indium compounds; Indium gallium arsenide; Indium phosphide; MODFETs; Metallization; Microwave measurements; Schottky diodes;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.145018
  • Filename
    145018