• DocumentCode
    927387
  • Title

    Bonding and interconnections for c.c.d.s

  • Author

    Jaggers, K.A.

  • Author_Institution
    University College of North Wales, School of Electronic Engineering Science, Bangor, UK
  • Volume
    11
  • Issue
    8
  • fYear
    1975
  • Firstpage
    161
  • Abstract
    A simple fabrication method to obtain reliable wire bonding to c.c.d.-type circuits is described.
  • Keywords
    charge-coupled devices; integrated circuit production; CCD; fabrication method; interconnections; wire bonding;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19750123
  • Filename
    4236636
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=927387