DocumentCode
933620
Title
Thermal impedance testing of high-speed gate arrays
Author
Brown, E.R. ; Beasley, K. ; Barber, W.L.
Author_Institution
Plessey Research (Caswell) Ltd., Towcester, UK
Volume
132
Issue
6
fYear
1985
fDate
12/1/1985 12:00:00 AM
Firstpage
277
Lastpage
280
Abstract
The paper describes a method for 100% testing of the thermal impedance of integrated circuits using a temperature-sensitive parameter. The approach is applicable to automated test procedures, and results are presented on its use in testing a high-speed gate array. Alternative methods for assessing thermal impedance are discussed.
Keywords
automatic testing; cellular arrays; integrated circuit testing; integrated logic circuits; logic testing; automated test procedures; high-speed gate arrays; logic IC testing; temperature-sensitive parameter; thermal impedance;
fLanguage
English
Journal_Title
Electronic Circuits and Systems, IEE Proceedings G
Publisher
iet
ISSN
0143-7089
Type
jour
DOI
10.1049/ip-g-1:19850055
Filename
4646613
Link To Document