DocumentCode
935300
Title
A new de-embedding technique for on-board structures applied to the bandwidth measurement of packages
Author
Van Hauwermeiren, Luc ; Botte, Marnix ; De Zutter, Daniël
Author_Institution
Lab. of Electromagn. & Acoust., Ghent Univ., Belgium
Volume
16
Issue
3
fYear
1993
fDate
5/1/1993 12:00:00 AM
Firstpage
300
Lastpage
303
Abstract
A de-embedding technique for on board structures or devices under tests (DUTs) is presented. The key feature of the method is the comparison between the S-parameter data for the embedded DUT and the data for a judiciously chosen reference situation. The technique also uses the time-domain option of modern network analyzers. The approach is illustrated by detailed bandwidth measurements for a high pin count package
Keywords
S-parameters; circuit analysis computing; packaging; printed circuit testing; time-domain analysis; S-parameter data; bandwidth measurement; de-embedding technique; devices under tests; high pin count package; network analyzers; on-board structures; time-domain option; Acoustic testing; Bandwidth; Circuits; Coaxial components; Impedance; Microstrip; Packaging; Scattering parameters; Semiconductor device measurement; Time domain analysis;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/33.232056
Filename
232056
Link To Document