• DocumentCode
    940073
  • Title

    On Ultra-Fine Leak Detection of Hermetic Wafer Level Packages

  • Author

    Goswami, Arindam ; Han, Bongtae

  • Author_Institution
    Maryland Univ., College Park
  • Volume
    31
  • Issue
    1
  • fYear
    2008
  • Firstpage
    14
  • Lastpage
    21
  • Abstract
    Theoretical and practical ranges of leak rates measurable by the helium mass spectrometer are characterized. The effect of noise due to: 1) background helium present in the spectrometer and 2) desorption of helium that attaches itself to the specimen surface during bombing is quantified experimentally. The results guide a framework to extract the true leak rate from the measured leak rate profile. An optical interferometry based hermeticity measurement technique for ultra-fine leaks is proposed. The setup to implement the technique is described and a preliminary experimental result is reported.
  • Keywords
    leak detection; wafer level packaging; hermetic wafer level packages; optical interferometry; ultra-fine leak detection; Helium fine leak test; hermeticity; optical interferometry; theoretical and practical limits; true leak rate;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2007.906385
  • Filename
    4358053